Chip Manufacturing

Back-End Defect Inspection

ICOS CI-3050
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Product Description

The CI-3050 Component Inspection System offers high-quality, 2D and 3D inspection of small lots and QA samples. The CI-3050 is the smallest automatic component inspection system available, and with its small footprint and easy operation, the CI-3050 Component Inspection System is offers unmatched user-friendliness.

Inspection types:
  • GW
  • J-Lead
  • BGA
  • CSP
  • Leadless devices
Applications:
  • 3D lead inspection
  • 3D ball inspection
  • Between balls inspection (option)
  • 2D and 3D QFN/BCC inspection

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