| 2367 |
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Cost-effective UV Line Monitoring
Product Description The 2367 UV/visible brightfield inspector provides sensitivity to a broad range of yield-relevant defect types for the 65nm and above design nodes. With significantly improved throughput over its predecessor, the 2367 enables high defect sampling for cost-effective production line monitoring. It is field-upgradeable from any of the widely adopted 23xx systems, providing improved inspection capability while protecting a fab's capital investment.
Applications Critical Pattern Layers (≥65nm): High resolution and noise-suppression technologies produce sensitivity to critical patterning defects, including: lithography CD variations and missing contacts; gate etch stringers; STI voids; and copper CMP corrosion. Photo Cell Monitoring (PCM): Using the 2367 with optimized test wafers, PCM accelerates learning on lithography processes, helping fabs to rapidly identify and eliminate lithography-related micro defects before committing product wafers. After-Develop Inspection (ADI): The 2367 minimizes process-induced noise on photo product wafers, enabling the detection of yield-limiting defects, such as poisoned photoresists, micro-bridges, and resist bubbles. PWQ: The Process Window Qualification (PWQ) application identifies printed reticle design errors, enabling lithographers to qualify the process window for their designs prior to production. Related Information
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