KLA-Tencor, through its ICOS division, offers a series of standalone defect inspection systems for various applications in the semiconductor packaging field. Our Component Inspector (CI) products inspect various semiconductor components that are handled in a tray, such as microprocessors or memory chips. Component defect inspection capability includes: 3D coplanarity inspection; measurement of the evenness of the contacts; and, 2D surface inspection to check the package’s surface aspects, the identification mark and the orientation. Our Wafer Inspector (WI) products inspect either undiced wafers, or diced wafers mounted on film frame carriers. They inspect surface quality of the wafers, the quality of the wafer cutting, or wafer bumps

Component Inspection

• ICOS CI-T620 Component Inspector: High production inspection with dual taping for low CoO
• ICOS CI-T120/CI-T130: High-volume inspection of Gull Wing, BGA, CSP and QFN devices
• ICOS CI-T120S/CI-T130S: Flip chip substrate inspection
• ICOS CI-3050: Semi-automated inspection for small lots or QA samples

Wafer Inspection

• ICOS WI-2xx0: Optical defect inspection and metrology of microelectronic devices on a variety of wafer substrates
• ICOS WI-22xx Series: Automated optical defect inspection and metrology of microelectronic devices on a variety of wafer substrates, surface inspection, and 2D bump inspection