SAN JOSE, Calif., June 27, 2005--KLA-Tencor (NASDAQ: KLAC) today unveiled its new Puma 9000 patterned wafer inspection platform--the first in a suite of next-generation inspection solutions that will set new performance standards across the full range of defect management requirements. Developed in close collaboration with customers to address the new defect and yield challenges emerging at the 65-nm and 45-nm nodes, the Puma 9000 combines a highly modular and extendible architecture with KLA-Tencor's revolutionary Streak™ imaging technology to enable the highest possible capture of critical defects at production throughputs. With more than 30 systems installed at leading fabs worldwide, the company reports that the Puma 9000 series is already delivering breakthrough cost and performance advantages to logic and memory chipmakers--making it one of the fastest ramping new inspection platforms in KLA-Tencor's history.

Hynix Semiconductor was among KLA-Tencor's early partners in testing the full range of the system's capabilities for advanced memory development. "Puma enabled our R&D group to detect extremely small defects of interest at very high throughputs," stated Sung Wook Park, executive vice president at Hynix. "Puma has also played a critical role in the development and production ramp of our 70-nm DRAM and Flash devices. As a result, this tool has been adopted in both our R&D and advanced 300-mm production lines."

Commenting on the need for the Puma 9000, Lance Glasser, group vice president of KLA-Tencor's Wafer Inspection Group, explained that chipmakers today face unprecedented challenges brought about by the consumer era, including new market, technology and cost dynamics. "Speeding time to market has never been more essential to our customers" profitability, nor have they previously faced such demanding cost pressures. As a result, they need powerful, high-value inspection systems they can rely on to accelerate their key technology transitions and improve their production processes--to ultimately speed yield ramps, time to market and return on investment (ROI) on their next-generation chips."

A New Breed of Inspection for the Sub-65-nm Era
The industry-leading performance of the Puma 9000 is enabled by KLA-Tencor's revolutionary Streak darkfield imaging technology, which overcomes the fundamental limitations of traditional scanning laser and photo multiplier tube (PMT)-based inspection systems. Scalable for multiple technology generations, Streak™ combines advanced ultraviolet (UV) illumination optics with high-speed imaging to provide a range of inspection modes optimized for critical defect detection without compromising throughput. A proprietary solid-state linear sensor is used to image the scattered light, which extends the dynamic range of the sensor to produce the best available signal-to-noise ratio, as well as a much more stable and repeatable measurement than can be achieved using PMTs.

Meets Critical Line Monitoring and CoO Requirements
In addition to the unique benefits provided by its Streak technology, the Puma 9000 retains the historical darkfield advantages of highly effective noise suppression and pattern filtering for improved defect capture on critical layers. Onboard inline automated defect classification (iADC) technology enables real-time classification and intelligent sampling, allowing customers to focus on their defects of interest. The platform's enhanced sensitivity over existing inspection systems, without compromising throughput, allows customers to cost-optimize their inspection strategies and achieve tighter production control.

Aimed at addressing chipmakers' stringent cost-of-ownership (CoO) requirements, the Puma 9000 architecture features a modular design with extendibility for multiple technology generations. Configurable by application, the Puma 9000 provides IC manufacturers with the advantage of a single-platform solution for the broadest range of inspection applications in both memory and logic production, plus cost-effective upgrade paths for future expansion. In addition, the system shares a common user interface with KLA-Tencor's latest brightfield and e-beam inspection systems, which reduces operator training and improves ease of use for rapid integration into production.

Defect Management Breakthroughs on the Horizon
"For our customers, driving the rapid technology changes required by industry leadership in a cost-effective manner can be extremely challenging," added Glasser. "Puma is part of our expanding portfolio of process control solutions that address our customers" twin demands for high performance and cost-effective inspection without compromise, to give them greater ability to drive down the costs and risks of advanced IC manufacturing."

KLA-Tencor reports that the Puma 9000 is the first tool in its complete suite of new inspection systems slated for production release over the coming months. Combining high defect capture with fast time to results, these highly extendible and production-worthy tools are expected to set new performance standards in the industry.

KLA-Tencor will showcase its latest yield management and process control products, including the Puma 9000, at SEMICON West 2005, July 12-14, at the Moscone Center in San Francisco, Calif. The company's booth is located in the South Hall, #426.

About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., the company has sales and service offices around the world. An S&P 500 company, KLA-Tencor was named one of the Best Managed Companies in America for 2005 by Forbes Magazine and is the only company in the semiconductor industry to receive the accolade for this year. KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC. Additional information about the company is available on the Internet at http://www.kla-tencor.com

Streak is a trademark of KLA-Tencor.

Contact:
Meggan Powers
Director Corporate Communications