SAN JOSE, Calif., Sept. 12, 2000-KLA-Tencor Corp. (Nasdaq: KLAC) today introduced its new TeraScan™ 570 system-a revolutionary high-throughput, deep ultraviolet (DUV) wavelength inspection platform designed to capture pattern defects generated during advanced reticle manufacturing at the 0.13-micron node and below. The TeraScan 570, whose development was jointly funded by International SEMATECH, provides a four-fold increase in throughput compared to KLA-Tencor's previous generation 300-Series tools and can detect defects as small as 100 nm. A member of KLA-Tencor's new Tera™ family of reticle inspection systems, the TeraScan 570 provides reticle-to-integrated circuit (IC) design data inspection capabilities to enable the production of the most advanced ICs, including microprocessors for high-end server applications such as enterprise-wide information technology systems.

Chipmakers are increasingly implementing sub-wavelength lithography strategies to extend the life of existing lithography tools, while continuing to aggressively shrink device geometries. Sub-wavelength lithography, however, introduces new complex patterns resulting from reticle enhancement techniques, such as optical proximity correction (OPC) and phase shift mask (PSM) technologies, which are extremely difficult and time-consuming to accurately inspect. The TeraScan 570, KLA-Tencor's new DUV system, is designed to inspect reticles used for 248 nm and 193 nm lithography applications and delivers both the speed and sensitivity required to accurately capture the new defects associated with these reticle enhancement techniques.

"We are pleased to have worked with KLA-Tencor on developing this new reticle inspection tool, which will help the photomask industry meet the challenges of the International Technology Roadmap for Semiconductors over the next five to ten years," said Mark Melliar-Smith, president and chief executive officer of International SEMATECH. "OPC and PSM technologies have been key to the manufacture of advanced ICs beyond the 0.18-micron node by enabling fabs to extend current lithography technologies."

The TeraScan 570 utilizes a multiple parallel sensor array illuminated by a non-linear, crystal frequency-doubled, argon-ion laser to deliver DUV wavelength inspection. The tool incorporates a superior image computer that allows the tool to achieve a 200 million pixel-per-second inspection rate and enables the use of proprietary algorithms to provide both die-to-die and die-to-database inspection with better than 100 nm sensitivity. The TeraScan 570 also uses parallel optical fibers to carry gigabits of data per second internal to the system for maximum throughput. It has more than a dozen active control loops to provide nanometer mechanical stability and an active force cancellation system to maintain near-perfect quiet on the floating 2,000-kg. granite optical bench. The TeraScan also supports existing defect data communication links to installed defect repair and defect review systems.

"Cost-effective and accurate inspection of today's advanced reticles requires the same level of computing sophistication that is needed to predict global weather patterns," noted Lance Glasser, general manager of KLA-Tencor's Reticle and Photomask Inspection Division. "The image computer incorporated into the TeraScan 570-as well as into TeraStar™, the other member of our Tera reticle inspection family-is as powerful as those used to forecast the weather. The level of reticle inspection provided by the TeraScan 570 will help our photomask manufacturing customers deliver the advanced reticles required to enable chipmakers to meet their future technology roadmaps."

Production shipments of the TeraScan 570 system will begin early next year.

About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., the company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC.

Contact:
Meggan Powers
Director Corporate Communications